The purpose of the gold ball wire bonder is to provide conductive leads from an integrated circuit chip or any other device needing connectivity so that power can be applied to and signals can be received from the finished devices. Typically the device is mounted on or in a standard PACKAGE but in some cases directly to a printed circuit board or other substrate. Ball bonding requires that the first bond be a ball type bond and the secondary bond be a capillary wedge bond. The bonding process requires the precise application of heat, ultrasonic energy, physical force and time to produce a durable connection between the device and the substrate.
4124 Manual Bonder
- Can be configured for Ball Bumping / TAB bonding
- Designed for Gold wire
- Semi-auto and manual operation modes
- Individual bonding parameter control
- Wide range of wire diameter
- Consistent ball size
- Easy operation (semi-auto, manual)
- Large bonding area
- Deep access option (0.0650" length Capillary)
- Direct access and simple adjustment to all bond parameters and programs
- Especially designed for bonding applications from simple discrete devices to complex hybrid and microwave devices
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KS Kulicke & Soffa 4124 Ball Wire Bonder
Specification
- Wire: Gold = 17.5µ to 75µ Spool = 2"
- Bonding Area: 152 X 152 mm (6 X 6 inch)
- Throat Depth: 143 mm (5.6 inch)
- Gross Table Motion: 140 mm (5.5 inch)
- Fine Table Motion: 14 mm (0.55 inch)
- Mouse Ratio: 6:1
- Z-Motion System: DC servo/LVDT control
- Z Travel: 9.1 mm
- Ultrasonic System: High Q 60 kHz transducer PLL ultrasonic generator
- Low Ultrasonic power: 1.3 W
- High Ultrasonic Power: 2.5 W
- Bond Time: 10-100 msec / 10-1000 msec
- Single Point TAB: Available
- Bond Force: Force coil 10-160 g
- Modes of Operation: Semi-auto, Manual Z