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Seikoh Giken SFP510 Wafer Grinding Lapping Polisher for Semiconductor

The Seikoh Giken SFP510 is a wafer grinding, lapping, and polishing system designed for high-precision surface processing in semiconductor and optical component manufacturing. It supports multi-wafer capability of up to eight wafers simultaneously, with advanced grinding and lapping functions that ensure smooth, uniform surface finishes and repeatable results. With a vibration-controlled platform, compatibility with a wide range of abrasive media, and automated alignment features, it delivers stable operation, consistent throughput, and dependable performance for advanced semiconductor fabrication and optical polishing applications
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SFP510
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Seikoh Giken SFP510 Polisher Machine

No polishing plates included. Unit sold for parts only.

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SFP510
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